Engineering Intern - Spring/Summer 2026

Who We Are:
Arieca is leading the commercialization of easy to deploy liquid metal embedded elastomer (LMEE) technologies, which enable unprecedented performance in applications across semiconductor, aerospace, automotive, and healthcare industries. Our TIMbber product line targets leading semiconductor and electric vehicles’ thermal interface material (TIM) challenges. As a CMU spin-out, venture-backed company, we are expanding our team to bring our lab innovations to market.

What You Will Do:
As part of our hardware R&D team, you will be responsible for testing the thermal and electrical properties of Arieca’s LMEE material architecture in laptops, desktop GPUs, and servers. You will be analyzing material samples according to company protocols and documenting all findings. This will involve disassembly, re-assembly, and characterization of each device using industry-standard benchmarks. In addition, you will calculate performance metrics using automated Python scripts that you will develop with your mentor. Your results will be used in the go-to-market strategy for our latest formulations, and will be distributed to external customers to aid in their evaluation of our materials.

Expected pay range: 15-25 $/hr depending on experience. We are accepting candidates for Spring 2026 as a part-time job, and summer 2026 as a full-time position. Both options comprise in-person work at 201 North Braddock Ave , Pittsburgh PA.

Key Requirements:
● Experience defining Design of Experiments (DoE) test suites, conducting experiments, and documenting results
● Methodical, reliable, and excellent at written and verbal communication
● Familiarity with Python and/or Matlab
● Ability to independently identify both trends and flaws in data, review data with our development team, and discuss possible optimizations
● Experience working in an industrial or academic research laboratory
● Currently enrolled in an ABET accredited Bachelor of Science or Master of Science program in Mechanical Engineering, Industrial Engineering, Computer Engineering, Electrical Engineering, or equivalent fields of study. Candidates with exceptional hands-on experience from other majors (including technical associates' degrees) are also encouraged to apply.

Nice-to-haves:
● Experience disassembling electronics for upgrading – laptops, desktop PCs, etc.
● Knowledge of thermal characterization techniques (TIME, FTDR, etc.) and benchmarking software (Cinebench, HWInfo, etc.)
● Rapid prototyping and machine shop experience

Note: this position is not officially endorsed or sponsored by any university. Please verify your eligibility for off-campus employment before applying.